| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for improving the productivity of an airtightly sealed IC package and lowering manufacturing costs. SOLUTION: After a number of chips are loaded inside a substrate and the internal electrode wiring of the substrate and the electrodes of IC chips are connected by a wire, a photosensitive material is applied to the entire substrate, a part of the IC chip other than a region required to be exposed to light is surrounded by the frame of the photosensitive material by using a photo etching method, heat treatment is performed and the photosensitive material is hardened. Then, transparent resin is applied and the part to be exposed to the light of the IC chip is covered. After the heat treatment is performed and the transparent resin is hardened, cutting off is performed at the intermediate position of the photosensitive material and each IC package is attained.
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