MULTILAYERED PRINTED CIRCUIT BOARD AND METHOD FOR FORMING METAL CIRCUIT LAYER

摘要

PROBLEM TO BE SOLVED: To provide a method for efficiently embedding an electronic component in a multilayered board at a cost reducing effect, and to provide a structure therefor. SOLUTION: The method for forming a metal wiring layer comprises steps of mounting a first integrated electronic component 20 on a surface 14 of a first substrate of a circuit board substrate 12, disposing a first dielectric layer 30 on the first substrate surface and the first integrated component, disposing a metal layer 40 on the first substrate surface to form an integrated electronic component assembly, forming at least one vias 40, 50 having a metal lining brought into contact with the metal layer in the component assembly, disposing a second dielectric layer 60 on the via and the metal layer, forming at least one opening 70 in the second dielectric layer and the first dielectric layer, so as to expose at least part of the component 20 to be first integrated, forming a metal lining 72 connected to the first integrated component in the opening, to form the circuit board having integrated electronic components.