发明名称 PACKAGING CONTAINER CHARGED WITH IC, AND CHARGING METHOD OF IC
摘要 PROBLEM TO BE SOLVED: To provide a packaging container on which an IC, which is hard to peel and has a high reliability is charged, and a charging method of the IC to the packaging container. SOLUTION: This packaging container (10) is constituted by sealing (13) the peripheral edges of two sheets of front and rear thermoplastic resin films or sheets (11 and 12). Then, a recess (14) is formed at one section of the sealed section (13) of one thermoplastic resin film or sheet (11). Then, the IC (15) is inserted in the recess for the packaging container. In this case, the recess is formed at one section of the peripheral edge of one of the thermoplastic resin films or sheets of the two sheets of the front and rear thermoplastic resin films or sheets. The IC is inserted in the recess, and then, the opened surface of the recess on the thermoplastic resin film or sheet is positioned to the inside, and the thermoplastic resin film or sheet is superposed on the other thermoplastic resin film or sheet (12). Then, the peripheral edges of the two sheets of the thermoplastic resin films or sheets are heat-bonded in a manner to enclose the IC.
申请公布号 JP2002370774(A) 申请公布日期 2002.12.24
申请号 JP20010183056 申请日期 2001.06.18
申请人 TOPPAN PRINTING CO LTD 发明人 IWASE HIROSHI;TOMATSURI TAKEO;TERUI MASATO
分类号 B65D25/20;B65D33/00;B65D75/54;(IPC1-7):B65D75/54 主分类号 B65D25/20
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