| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having no lead terminal in which the quality is enhanced at the soldered joint between the semiconductor device and a printed wiring board by relaxing mechanical stress and thermal stress applied thereto. SOLUTION: In a semiconductor device comprising a carrier having an upper surface for mounting a semiconductor element and a lower surface for arranging a plurality of component electrodes in check pattern at a specified interval, a lead pin inserted into the through hole of a printed wiring board for mounting the semiconductor device is provided at the position of a component electrode formed remotely from the central part of a plurality groups of component electrodes. Furthermore, a lead pin inserted into the through hole of a printed wiring board for mounting the semiconductor device is provided at the position of a component electrode formed in the vicinity of the semiconductor element and remotely from the central part thereof. The lead pin is preferably projected high up to the height of the semiconductor element mounted on the upper surface of the carrier.
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