发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
A substrate processing apparatus is provided with five inspection devices that perform inspections of different kinds to a substrate. Among the five kinds of inspections, the film quality is measured after resist coating, and before post-coating heat-treatment. As the film quality, the amount of solvent remaining in a resist film is measured. The film thickness is measured after heat-treatment following resist coating and before exposure. Meanwhile, the line width and the superposition precision are measured and macroscopic defect inspection is performed after post-development heat-treatment and before the substrate is returned to an indexer.
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申请公布号 |
US2002192358(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020170776 |
申请日期 |
2002.06.12 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
KANEYAMA KOJI;HISAI AKIHIRO |
分类号 |
B05C11/00;B05C11/08;B05D1/40;B05D3/00;B05D3/02;G03F7/16;H01L21/00;H01L21/027;H01L21/677;(IPC1-7):B05D1/00 |
主分类号 |
B05C11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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