发明名称 Substrate processing apparatus and substrate processing method
摘要 A substrate processing apparatus is provided with five inspection devices that perform inspections of different kinds to a substrate. Among the five kinds of inspections, the film quality is measured after resist coating, and before post-coating heat-treatment. As the film quality, the amount of solvent remaining in a resist film is measured. The film thickness is measured after heat-treatment following resist coating and before exposure. Meanwhile, the line width and the superposition precision are measured and macroscopic defect inspection is performed after post-development heat-treatment and before the substrate is returned to an indexer.
申请公布号 US2002192358(A1) 申请公布日期 2002.12.19
申请号 US20020170776 申请日期 2002.06.12
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 KANEYAMA KOJI;HISAI AKIHIRO
分类号 B05C11/00;B05C11/08;B05D1/40;B05D3/00;B05D3/02;G03F7/16;H01L21/00;H01L21/027;H01L21/677;(IPC1-7):B05D1/00 主分类号 B05C11/00
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