HEAT SINK AND THERMAL INTERFACE HAVING SHIELDING TO ATTENUATE ELECTROMAGNETIC INTERFERENCE

摘要

Heat sink (14) and electrically non-conducting thermal interface (10) having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate (18) having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers (16-20) of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate (52) coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The baseplate is attachable to a heat-dissipating component (12), and may optionally include a ground contact connection for use with components that are not already grounded.