发明名称 ETCHING AGENT FOR COPPER OR COPPER ALLOY, AND ETCHING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an etching agent for smoothening the surface of copper under a mild condition, and to provide an etching method for smoothening the surface. SOLUTION: The etching agent for copper or a copper alloy consists of an aqueous solution containing hydroxylamine keeping the solution alkaline, and suppressing the decomposition of an oxidizer, an oxidizer for oxidizing copper, and accelerating its dissolution into the solution, ammonium salt feeding ammonia ions into the solution, and accelerating the dissolution of copper, and an azole compound suppressing the dissolution of copper in the vertical direction, and accelerating the dissolution of copper in the horizontal direction.
申请公布号 JP2002363777(A) 申请公布日期 2002.12.18
申请号 JP20010169718 申请日期 2001.06.05
申请人 MEC KK 发明人 ONO HIDEICHIRO;NAKAMURA SACHIKO
分类号 C23F1/34;(IPC1-7):C23F1/34 主分类号 C23F1/34
代理机构 代理人
主权项
地址