发明名称 |
Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
摘要 |
<p>The invention concerns a flexible substrate comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides a semiconductor device comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides for a manufacturing method a semiconductor device comprising a substrate, an external connection terminal, and an inner lead with a base film. Further, the invention provides a semiconductor device with a substrate with a chamfered corner between the connection and side faces. By the invention, connection of an inner lead or a flexible substrate is made easier. <IMAGE></p> |
申请公布号 |
EP1267403(A2) |
申请公布日期 |
2002.12.18 |
申请号 |
EP20020012994 |
申请日期 |
2002.06.12 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
HAMAMOTO, OSAMU;SATO, KOJI;KAJIWARA, KENJI |
分类号 |
H01L23/498;H01L25/04;H05K1/11;H05K3/40;(IPC1-7):H01L23/495;H01L27/146 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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