| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent gas leakage from occurring due to halogen-based corrosive gas corroding a soldering material layer, which joints a ceramic plate body, and a cylindrical body forming a wafer support member corroding. SOLUTION: The wafer support member 2, which has the cylindrical body jointed with the opposite surface via the ceramic plate body 3 from its mounting surface 4 and a ceramic porous film 13 which has minute pores, is bonded covering the outer exposure part of at least the soldering material layer 12.</p> |
