| 摘要 |
<p>The invention relates to a method for manufacturing printed circuit boards from an extruded polymer, comprising the following steps: preparing an electroconductive plate (10) and forming reliefs (11) by means of selective etching on a first face (10a) corresponding to the future tracks and grooves (12) between the tracks; applying a pasty or semi-pasty dielectric substrate material in the form of a first plate (20a) obtained by extrusion from a thermoplastic material and placing said plate on the first face (10a) in such a way that it covers the reliefs (11) and fills the grooves (12) and then subjecting the first layer (20a) and the plate (10) assembly to a predetermined pressure so that the dielectric substrate material fully fills said grooves (12) and soaks the reliefs (11) and carrying out a second selective etching operation on the hardened dielectric substrate on the face opposite the first face (10a) and eliminating the material corresponding to the future space in-between the tracks.</p> |
