发明名称 System for providing IC bonding diagram via network
摘要 The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to store lead frame information. A job database is coupled to the processing unit to store information forwarded by a potential client, wherein the job database includes buyer satisfaction data provided by said user. A bonding diagram generator is coupled to the processing unit to generate a layout of bonding diagram in accordance with the information provided by the user. A forwarding module is responsive to the bonding diagram generator to forward the layout of bonding diagram to the user.
申请公布号 US2002188371(A1) 申请公布日期 2002.12.12
申请号 US20010815998 申请日期 2001.03.22
申请人 CHUANG CHUN-MIN;LIN I-LIANG;LIN CHUN-KUANG;YEH YUNG-I 发明人 CHUANG CHUN-MIN;LIN I-LIANG;LIN CHUN-KUANG;YEH YUNG-I
分类号 G06F17/50;G06F19/00;(IPC1-7):G06F19/00 主分类号 G06F17/50
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