发明名称 |
System for providing IC bonding diagram via network |
摘要 |
The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to store lead frame information. A job database is coupled to the processing unit to store information forwarded by a potential client, wherein the job database includes buyer satisfaction data provided by said user. A bonding diagram generator is coupled to the processing unit to generate a layout of bonding diagram in accordance with the information provided by the user. A forwarding module is responsive to the bonding diagram generator to forward the layout of bonding diagram to the user.
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申请公布号 |
US2002188371(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
US20010815998 |
申请日期 |
2001.03.22 |
申请人 |
CHUANG CHUN-MIN;LIN I-LIANG;LIN CHUN-KUANG;YEH YUNG-I |
发明人 |
CHUANG CHUN-MIN;LIN I-LIANG;LIN CHUN-KUANG;YEH YUNG-I |
分类号 |
G06F17/50;G06F19/00;(IPC1-7):G06F19/00 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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