发明名称 Circuit arrangement
摘要 A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary connections. Components such as power transistors, are in contact with the conductive strips and the auxiliary connections. The intermediate-circuit board includes a positive-pole DC connection and negative-pole DC connection and electrical capacitors connected between them. An AC connection element that must be cooled is assigned to each substrate. The positive-pole DC connection and the negative-pole DC connection include contacts for direct low-inductance connection with the corresponding conductive strips of the one or more substrates. The equivalent applies to the one or more AC connection elements. The compression device electrically connects the contacts of the positive-pole and negative-pole DC connections and the contacts of the one or more AC connection elements.
申请公布号 US2002186543(A1) 申请公布日期 2002.12.12
申请号 US20020138023 申请日期 2002.05.02
申请人 SEMIKRON ELEKTRONIK GMBH 发明人 GOBL CHRISTIAN;TRUSKY WERNER;STEGER JURGEN;BECKEDAHL PETER;MOURICK PAUL
分类号 H05K7/20;H01L25/07;H01L25/16;H01L25/18;H05K1/02;H05K1/18;(IPC1-7):H05K7/20 主分类号 H05K7/20
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