| 摘要 |
PROBLEM TO BE SOLVED: To provide a waxless mount polishing method preventing the outer periphery erected on a semiconductor wafer. SOLUTION: At the time of polishing, a silicon wafer W is housed in a template 14 and the silicon wafer W is sucked on a suction pad 15 by the surface tension of water. At the time, a wafer outer periphery is projected more outward than the center part. While keeping the state, a polishing head 12 is rotated, while supplying an abrasive onto a polishing cloth 13 and the surface of the silicon wafer W is pressed to the polishing surface of the polishing cloth 13 and polished. As a result, for the outer periphery of the silicon wafer W, a contact area per unit time with the polishing cloth 13 and pressure per unit area become large as compared with the center part. Thus, the outer periphery erection of the silicon wafer W is prevented. |
