| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solder-resistant resin layer, exhibiting superior thermal fatigue resistance in thermal hysteresis or temperature cycle test(TCT) at the time of mounting and superior moisture resistance in high accelerating speed test(HAST), and a wiring board and an electronic device using it. SOLUTION: The solder resistant resin layer 3 is formed, by hardening a thermosetting resin composition containing an elastomer for imparting flexibility, and a planer clay-based insulation filler having average grain size of 0.1-2μm where the Erichsen value thereof is 3-10 mm.</p> |
