| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module, in which manufacturing cost is reduced, and simultaneously performance, reliability and useful years are improved. SOLUTION: Elements 8 are arranged partly at least on first main surfaces, contacted by using a conductor passage and a flexible conductor plate 9 having a contact surface; the plate 9 is connected to the elements 8 each other, in response to a circuit and/or to a contact surface 3 of a substrate 2; thus, the plate 9 forms a connector, in response to the circuit to an electric connector of a module in response to the circuit and/or a connector in response to the circuit to a contact surface 6 of at least one external conductor plate 5. |
