| 摘要 |
PROBLEM TO BE SOLVED: To shorten the processing time of the drying process of a semiconductor wafer 20 and to improve the throughput of the semiconductor wafer 20. SOLUTION: By using an encoder 41 for positioning, instead of an origin detection sensor 17, and also using an AC servo motor 40 as a motor, a servo driver 42 for driving the AC servo motor 40 and a servo controller 43 for controlling the AC servo motor 40, and using signals from the encoder 41 for positioning as feedback signals, the AC servo motor 40 is rotated at a high speed. Also, by shortening the time, after a drying operation is ended until the speed is reduced and it is stopped at an origin detection position, the processing time of the drying process of the semiconductor wafer 20 is shortened.
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