发明名称 Radiation temperature measuring method and radiation temperature measuring system
摘要 The present invention intends to improve the accuracy of temperature measurement when measuring the temperature of a semiconductor wafer by a radiation thermometer on the basis of the idea of virtual blackbody simulated by multiple reflection of light. A system includes a wafer (W), a circular reflector 1 of a radius R disposed opposite to the wafer (W), and a probe (2) disposed in a through hole formed in the reflector (1). The probe (2) is a through hole. The radiation intensity of radiation passed the through hole is determined by image data provided by a CCD camera disposed behind the back surface of the reflector (1). An error in measured radiation intensity of radiation falling the probe (2) due to light that enters a space between the wafer (W) and the reflector (1) and a space between the reflector (1) and the probe (2) and light leaks from the same spaces is corrected, the emissivity of the wafer (W) is calculated and the temperature of the wafer (W) is determined.
申请公布号 US6488407(B1) 申请公布日期 2002.12.03
申请号 US20000527243 申请日期 2000.03.17
申请人 TOKYO ELECTRON LIMITED 发明人 KITAMURA MASAYUKI;MORISAKI EISUKE;TAKAHASHI NOBUAKI;SHIGEOKA TAKASHI
分类号 G01J5/00;G01J5/02;H01L21/66;(IPC1-7):G01J5/00;G01J5/08 主分类号 G01J5/00
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