SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To provide a highly reliable semiconductor device which can be easily manufactured, in which production efficiency can be improved and a manufacturing cost is reduced. CONSTITUTION: In the semiconductor device wherein an outside connection terminal 50 electrically connecting the electrode 12 of a semiconductor element through a wiring pattern 52 to the electrode formation face of the semiconductor element is formed, the outside connection terminal 50 is formed of a wire consisting of an electrically conductive material, and the bonding part side of the wire is provided to be buried in a metal layer forming the wiring pattern 52.