| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device capable of miniaturizing a multi- chip module employing an interposer substrate and a manufacturing method therefor. SOLUTION: The substrate has a structure in which embedded electrodes 4 penetrating an interposer substrate 1 are provided, one-end sides of respective substrates 4 are brought into contact with connecting electrodes 2 on which device chips 10 are flip-chip mounted, and the electrodes 4 are connected to a mounting substrate (not shown) via bump electrodes 5 provided on the other ends. That means, since the electrodes to be connected to the mounting substrate are drawn from the rear surface of the substrate 1, the multi-chip module can be miniaturized. |
