发明名称 SEMICONDUCTOR DEVICE MANUFACTURING FACILITY
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing facility which can increase a production content of a unit production line by installing more manufacturing facilities so as to enable a space of each facility to be easily assured to the line of a limited semiconductor device. SOLUTION: The semiconductor device manufacturing facility installed in a semiconductor device production line comprises a robot means Ra installed in a transfer chamber 30a and having a robot arm 18 for selectively fixing a wafer W to drive to extend or contract, to vertically move and to rotate the arm 18, and a process chamber 32a and a load locking chamber 34a selectively coupled to communicate with the chamber 30a and disposed in a height direction.
申请公布号 JP2002343848(A) 申请公布日期 2002.11.29
申请号 JP20020000564 申请日期 2002.01.07
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 SAI TETSUKAN;KIM YOKO;CHO SANKO
分类号 B25J9/04;H01L21/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B25J9/04
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