发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING FACILITY |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing facility which can increase a production content of a unit production line by installing more manufacturing facilities so as to enable a space of each facility to be easily assured to the line of a limited semiconductor device. SOLUTION: The semiconductor device manufacturing facility installed in a semiconductor device production line comprises a robot means Ra installed in a transfer chamber 30a and having a robot arm 18 for selectively fixing a wafer W to drive to extend or contract, to vertically move and to rotate the arm 18, and a process chamber 32a and a load locking chamber 34a selectively coupled to communicate with the chamber 30a and disposed in a height direction. |
申请公布号 |
JP2002343848(A) |
申请公布日期 |
2002.11.29 |
申请号 |
JP20020000564 |
申请日期 |
2002.01.07 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
SAI TETSUKAN;KIM YOKO;CHO SANKO |
分类号 |
B25J9/04;H01L21/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
B25J9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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