发明名称 ALTERNATIVE SOLDER
摘要 PROBLEM TO BE SOLVED: To provide alternative solder of adhesives with conductivity which does not contain lead instead of lead system solder having a problem of heavy metal pollution. SOLUTION: It is the alternative solder having conductivity, which is made by mixing acetic acid vinyl resin emulsion system resin and a conductive pollution-free substance. The pollution-free substance of the alternative solder 5 is carbon powder, carbon long/short fibers, or pollution-free metal powder.
申请公布号 JP2002343134(A) 申请公布日期 2002.11.29
申请号 JP20010152105 申请日期 2001.05.22
申请人 FUNADA MASAYOSHI;TORII KOZO;HARADA KUNIHIKO 发明人 FUNADA MASAYOSHI;TORII KOZO;HARADA KUNIHIKO
分类号 H01B1/20;(IPC1-7):H01B1/20 主分类号 H01B1/20
代理机构 代理人
主权项
地址