发明名称 METHOD FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To accurately and easily cut off circuit patterns from each other by removing connecting patterns. SOLUTION: At the time of forming the circuit patterns 12 on a board 10 provided with projecting sections 11 on its surface, the portions of the patterns 12 to be cut lastly are formed so as to pass over the projecting sections 11. Thereafter, the patterns 12 are cut off from each other by removing the portions of the patterns 12 passing over the projecting sections 11.
申请公布号 JP2002344119(A) 申请公布日期 2002.11.29
申请号 JP20010151382 申请日期 2001.05.21
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SUZUKI TOSHIYUKI;NAKAGAWA KAZUYA;KOBAYASHI MITSURU;SHIOHAMA EIJI;SUGIMOTO MASARU;KIMURA HIDEYOSHI;HASHIMOTO TAKUMA
分类号 H05K1/02;H05K3/00;H05K3/22;H05K3/26;(IPC1-7):H05K3/22 主分类号 H05K1/02
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