| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component with a bump which can be easily and inexpensively manufactured with satisfactory yield. SOLUTION: A recessed part is formed in a substrate by stamping, and a UV resin is applied to the surface of the substrate except for the recessed part, and hardened to form a resist film. Then, electrodes 11 and 12 are formed on the surface of the recessed part by a plating method. A chip 14 is loaded on the electrode 11, and the pad of the chip 14 is connected through a wire 15 with the electrode 12. The chip 14 and the wire 15 are sealed by the resin so that a mold body 16 can be formed, and a substrate 1 is removed, and the electrodes 11 and 12 are exposed so that a bump can be formed. |
