| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the mounting strength can be improved and a solder bridge can be prevented. SOLUTION: A semiconductor device 1 has a package 2 and a plurality of leads 3, extending from the periphery of the package 2, and each lead 3 has a lead foot portion 4, having a structure of being bent midway by a single step and overlapping the land of a wiring board at its end. In each lead 3, a groove 5, capable of sucking up a solder connecting the land to the portion 4 by capillary phenomenon, is provided to range from the part facing to the land to the upright part 4b which is located remote from the land of the portion 4. |
