摘要 |
An HGA includes a magnetic head slider with at least one thin-film magnetic head element, a resilient flexure made of a stainless steel, supporting the magnetic head slider, a load beam made of a stainless steel, supporting the flexure, for applying a predetermined load to the magnetic head slider, a drive IC chip with a circuit for the at least one thin-film magnetic head element, a lead conductor member on which the drive IC chip is mounted, and a high-thermal-conductivity member made of a material with a higher thermal conductivity than that of the stainless steel and inserted between the lead conductor member and the load beam in a region containing at least a section on which the drive IC chip is mounted.
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