| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a tape with ball terminals and a semiconductor device using the tape which attempts to eliminate sealing in sealing resin and to minimize, to reduce a cost and to improve a junction strength of a semiconductor chip. SOLUTION: This device is comprised of a polyimide film 3 which has a size which is the same as or smaller than that of a mounted semiconductor chip 1, a junction pad 6 for junction of the semiconductor chip 1 formed on the surface of the film 3, a ball forming pad 11 which is junctioned by the junction pad 6 and an inducing lead 4 and a ball terminal 5 which is formed on the rear surface of the film 3 and is junctioned via the ball forming pad 11 and a via hole 10. The device is junctioned with the semiconductor chip 1 by performing tin plating 13 on the surface of the junction pad 6 and by forming gold-tin common crystal alloy on the junction boundary surface via a gold bump 2.</p> |
