| 摘要 |
<p>The invention relates to a multi-phase layer system with packaging, characterized in that a first layer (3) which forms an outer wall, a second layer (11) which forms a separating layer and a third layer (14) forming another outer wall are provided. A moist layer (4) is placed between the first (3) and the second layer (11) and a dry layer (13) is placed between the second (11) and the third (14) layer. All directly adjacent layers have a common, interconnected preferably soldered area. In addition, the sides of the second (11) and third (14) layer which face the inner area surrounded by the first (3) and second (11) layers are air-tight and moisture-proof.</p> |
