发明名称 |
Bond pad structure and method for reduced downward force wirebonding |
摘要 |
A bond pad structure for an integrated circuit has bondable base member for receiving a wire bonded thereon. A cavity is formed within the base member, with the cavity being configured to capture the wire therein. The cavity has one end having a first width and an opposite end having a second width, with the first width being greater than second width.
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申请公布号 |
US6478212(B1) |
申请公布日期 |
2002.11.12 |
申请号 |
US20010760955 |
申请日期 |
2001.01.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ENGEL BRETT H.;MCGAHAY VINCENT JAMES;NYE, III HENRY ATKINSON |
分类号 |
B23K20/00;B23K33/00;H01L21/607;H01L23/485;(IPC1-7):B23K37/00;B23K31/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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