ELECTROLYTIC COPPER FOIL FOR FINE PATTERN AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide copper foil which has a high etching factor without lowering peeling strength, can attain fine pattern without leaving copper particles at a root of a wiring pattern and further has large high temperature elongation percentage and high tensile strength. SOLUTION: Electrolytic copper foil of this invention is characterized by that roughening treatment is executed on a deposition surface of the copper foil in which surface roughness Rz of the deposition surface of untreated copper foil is the same as or is smaller than surface roughness Rz of a glossy surface of the untreated copper foil.