| 摘要 |
<p>An epoxy foam-forming composition contains (a) an epoxy compound having more than 1 epoxy group per molecule, (b) cell size regulators, (c) foaming agent, (d) Lewis acids and/or phosphoric acids as curing agents, (e) diisocyanates or polyisocyanates (possibly blocked) of particle size 400 mu, which are scarcely soluble in the reaction mixture at room temperature and whose melting point is above 40 deg.C and is preferably between 80 deg. and 200 deg.C, and optionally (f) polyphenols. There is 1 to 20%, especially 4 to 15%, of (e) and 2 to 25%, especially 2 to 15%, of (f), based on weight of (a).</p> |
