| 摘要 |
An electronic apparatus, which is inexpensive, has high packaging density, and has superior heat dissipating characteristics and reliability is provided. The electronic apparatus is provided with an electronic circuit substrate in which a heat generating first electronic component is mounted on its surface, and a case for housing the electronic circuit substrate. The electronic circuit substrate has a plurality of through holes formed directly under the first electronic component and thermally connected to the first electronic component. The electronic circuit substrate also contains a grounding pattern that is thermally connected to the through holes. The case has a protruding portion which contacts a rear surface portion of the electronic circuit substrate directly under the first electronic component, and which is thermally connected to the through holes.
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