Zusammengesetzte Weichlotpaste für Löthöcker für Flip-Chip-Montage

摘要

Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first temperature during bumping reflow while the photoresist mask is present, yet upon subsequently reheating to a higher temperature yield solder joints capable of withstanding temperatures of 200 DEG C and higher. As such, the present invention retains the advantages associated with using a dry film photoresist as a mask during deposition of the solder, yet results in the formation of solder joints that exhibit enhanced reliability in severe thermal environments.