发明名称 |
Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed |
摘要 |
A method for forming wafer level package that has a serpentine-shaped electrode formed along a scribe line in-between two adjacent IC dies and the package formed are disclosed. In the method, each of the I/O redistribution lines connecting from an I/O redistribution pad is connected to a serpentine-shaped electrode for providing electrical communication during a subsequent electro-deposition process for forming a solder bump on the corresponding I/O redistribution pad. During a dicing operation of the wafer level package, a single cut through the center of the serpentine-shaped electrode can effect severance of all IC dies without possibility of any inter-die shorting or intra-die shorting.
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申请公布号 |
US2002163069(A1) |
申请公布日期 |
2002.11.07 |
申请号 |
US20010846932 |
申请日期 |
2001.05.01 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LU MING;LU SZU-WEI |
分类号 |
H01L21/60;H01L23/31;(IPC1-7):H01L29/40;H01L23/52;H01L23/48;H01L21/301;H01L21/46 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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