SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to realize to unite complex functions in a package and improve the speed of converting process of light signal and minimize bonding area. CONSTITUTION: A semiconductor package include both photonic integrated circuit chip(30) and general integrated chip as a stacked structure. The unit(10) is formed by etching conducting pattern(14) on both side of an insulating-resin layer(12). An input or output of electric signal is performed through a bonding pad of each chip and exposed bonding region of the conducting pattern. The bonding pad(22a) of bottom chip is connected to conducting pattern of the substrate by metal bump. The photonic integrated circuit is connected to the top surface of the bottom chip by using bonding material(31). A covering glass(38) for light transmission is attached to the top surface of the chip.