| 摘要 |
PURPOSE: A CSP(Chip Scale Package) and a method for manufacturing the same are provided to improve a reliability and to simplify manufacturing processes without using a bonding process of a metal wire. CONSTITUTION: Each bump ball(106) is attached to a plurality of chip pads(102) formed in a wafer(100). An adhesive(104) is coated to expose the bump balls(106). Through holes(108) are formed in a substrate(120). An interconnection(122) having a metal ring is formed on the substrate(120). A protection layer(136) is formed on the interconnection(122) so as to expose a ball land(124) and the thorough hole(108). The substrate(120) is then bonded to the adhesive(104). A conductive layer(112) is formed on the through hole(108) so as to connect between the bump balls(106) and the interconnection(122). A conductive ball(134) is bonded on the ball land(124). The resultant structure is sawed to a unit chip. |
