| 摘要 |
<p>A production method for bonded substrates comprising the step of joining at least two substrates, and the step of heat treating the joined substrates to firmly bond them, characterized in that the cleaning step of removing contaminants is carried out at least prior to joining the substrates, and then the step of drying cleaned substrate surfaces is carried out without using a water substituting method to leave water content on unjointed substrates, thereby increasing the joining strength of the joined substrates. The production method for a bonded substrate as described above can produce, with high productivity and yield, substrates enhanced in joining strength at the joint interface between joined substrates and free from defects such as voids and blisters at the joint interface between bonded substrates after bonded by heat treating.</p> |
