发明名称 CONNECTING METHOD AND CONNECTING STRUCTURE EMPLOYING WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To provide a connecting method employing wire bonding in which strength at a primary bonding part is prevented from lowering due to vibration applied to a wire at the time of secondary bonding. SOLUTION: Forward end part of a wire bonding tool 10 is connected with a first member 1 and then the wire 3 is routed to a second member 2 by means of the tool 10. Under a state where a part of the wire 3 between the joint to the first member 1 and the joint to the second member 2 is supported using a retaining jig 11, the wire 3 is connected with the second member 2 being applied with ultrasonic vibration.
申请公布号 JP2002319596(A) 申请公布日期 2002.10.31
申请号 JP20010123007 申请日期 2001.04.20
申请人 DENSO CORP 发明人 MAEDA YUKIHIRO;NAGASAKA TAKASHI;OTANI YUJI
分类号 H01L21/60 主分类号 H01L21/60
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