| 摘要 |
PROBLEM TO BE SOLVED: To dispense with the need to develop TCP circuit patterns severally, in matching with the connection process of input/output terminals, by enabling the in/out terminals to be connected in any connection process. SOLUTION: In a tape carrier package, where an IC chip 4 is arranged on a tape carrier 11 and an input terminal 3 is connected from one side of the IC chip 4 and a output terminal 5 is connected from the other side of the IC chip, each of the circuit patterns of the above input terminals 3 is provided with both places of a section 3a for solder connection and a section 3b for anisotropic conductive film connection, whereby either of both connection processes can be used.
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