发明名称 |
Method and apparatus for electrochemically depositing a material onto a workpiece surface |
摘要 |
A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one electrical conductor disposed therein. The multi-process workpiece apparatus also includes a planarization apparatus and at least one workpiece handling robot configured to transport a workpiece from the electrochemical deposition apparatus to the planarization apparatus. |
申请公布号 |
AU2002256176(A1) |
申请公布日期 |
2002.10.28 |
申请号 |
AU20020256176 |
申请日期 |
2002.04.10 |
申请人 |
SPEEDFAM-IPEC CORPORATION |
发明人 |
NIKOLAY N. KOROVIN;ISMAIL EMESH;BRIAN L. MUELLER;SAKET CHADDA |
分类号 |
B23H5/08;C25D5/06;C25D5/22;C25D7/12;C25D17/14;H01L21/00;H01L21/288;(IPC1-7):C25D7/12 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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