| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device capable of suppressing cracks and having high reliability, a method for manufacturing the surface acoustic wave device and communication equipment. SOLUTION: A surface acoustic wave element 1 is provided with an electrode pad 2. A package 11 for electronic parts is provided with an electrode pattern part 6. A metal bump connection part 5 is formed by a flip chip method utilizing an ultrasonic wave for the connection of the electrode pad 2 and the electrode pattern part 6. The electrode pad 2 includes Al as a main component and Cu as an auxiliary component, the weight ratio of Cu being >=3.5%. |
