FLIP-CHIP MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a flip-chip mounting method for preventing a void from being produced between a semiconductor chip and a board. SOLUTION: The flip-chip mounting method includes (A) a step of drying the board, and (B) (1) a step of dispensing an uncured sealing agent at least to a portion on the surface of the board where a bump is pressure bonded and/or whole part of the board where fine bumps and dips exist, or (2) a step of pressure bonding the bump to the board or curing the sealing agent while keeping a temperature condition such that a temperature difference between the semiconductor chip and the board does not substantially cause convection in the uncured or curing sealing agent.