| 摘要 |
<p>A sputter deposition apparatus (10) for depositing a film (25) onto a substrate (19) includes a surrogate rotating magnetron (12) includes an internal magnet (28) and a wall thickness (12W) that permtis a fringe magnetic field to support an electron cyclotron resonance (31). Auxiliary coating sources (12, 13) are modulated for depositing a desired sequence of material onto the substrate (19).</p> |
