| 发明名称 |
Electroetching process and system |
| 摘要 |
A system for optionally depositing or etching a layer of a wafer includes mask plate opposed to the wafer with the mask plate having a plurality of openings that transport a solution to the wafer. An electrode assembly has a first electrode member and a second electrode member having channels that operatively interface a peripheral and center part of the wafer. The channels transport the solution to the mask.
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| 申请公布号 |
US2002153097(A1) |
申请公布日期 |
2002.10.24 |
| 申请号 |
US20010841622 |
申请日期 |
2001.04.23 |
| 申请人 |
NUTOOL, INC. |
发明人 |
BASOL BULENT M.;UZOH CYPRIAN;YAKUPOGLU HALIT N.;TALIEH HOMAYOUN |
| 分类号 |
B23H5/08;C25F3/14;H01L21/288;H01L21/321;H01L21/3213;H01L21/768;(IPC1-7):H01L21/461;C23F1/00;C23F1/02;H01L21/302;H01L21/306 |
主分类号 |
B23H5/08 |
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