发明名称 MOISTURE-CURING RESIN COMPOSITION AND SEALER FOR INORGANIC MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a sealer which is used for reinforcing the surface layer of a porous inorganic material, is excellent in the infiltration into the surface layer of the inorganic material, and has good adherence to a top coating film and excellent reactivity therewith. SOLUTION: The moisture-curing resin composition contains (A) a polyisocyanate component containing two or more free isocyanato groups in the molecule and having a molecular weight of 300 to 3,000 and (B) an isocyanate component having a molecular weight of less than 300 and a vapor pressure of 0.5 Pa or lower. The sealer for reinforcing the surface layer of the porous inorganic material contains the composition as the main constituent.
申请公布号 JP2002308961(A) 申请公布日期 2002.10.23
申请号 JP20010115360 申请日期 2001.04.13
申请人 ASIA KOGYO KK 发明人 SUGIMOTO KAZUYA;MORIYAMA AKISUKE;MIYATA YUTAKA
分类号 C09K3/10;C08G18/72;(IPC1-7):C08G18/72 主分类号 C09K3/10
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