| 摘要 |
PROBLEM TO BE SOLVED: To prevent position shift of an ink ejection nozzle with respect to a pressurizing chamber due to thermal strain which may occur when an adhesive is cured in the case where a head substrate is bonded to an orifice plate. SOLUTION: A thermal strain correction section 15 that prevents position change of the ink ejection nozzle 13 by correcting the thermal strain of the orifice plate 4 to be bonded to the head substrate 2 is formed on the orifice plate 4. While the orifice plate 4 has the thermal strain when the orifice plate 4 is bonded to the head substrate 2, the dimension change due to the thermal strain is corrected by the thermal strain correction section 15. As a result, it is possible to prevent the shift of the ink ejection nozzle 13 with respect to the pressurizing chamber 12.
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