发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device which efficiently drills a hole having a high aspect ratio. SOLUTION: A variable focal distance means which is composed of a lens 3 and a bens moving means 13 is arranged between an aperture 2 and an fθlens 7. When the lens 3 is moved, the position of the aperture 2 looked from the fθlens 7 varies and the position of an image formation plane 12 of the aperture 2 varies in the direction of the optical axis. Thus, the intensity distribution of a laser beam on the surface of a work 8 is kept constant by moving the lens 3 in time with the proceeding of the machining.</p>
申请公布号 JP2002307180(A) 申请公布日期 2002.10.22
申请号 JP20010115430 申请日期 2001.04.13
申请人 HITACHI VIA MECHANICS LTD 发明人 MORI SADAO;SUGAWARA HIROYUKI;AOYAMA HIROSHI
分类号 B23K26/04;(IPC1-7):B23K26/04 主分类号 B23K26/04
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