| 摘要 |
PURPOSE: A singulation system for a semiconductor device is provided to improve the speed of singulation process of semiconductor package by removing timing delay between loading, cutting, and transporting procedure and offer diversity of unloading machine by giving an option of selecting either tray or tube. CONSTITUTION: A singulation system is composed of a loading device(100), on which a lead frame is loaded, an inlet device(200), picking up and moving the lead frame to a cutting device(300), cutting the lead frame into a separated package, a transporting device(400) equipped with two unit picker(420,430), alternatively moving the package along the Y-axis, when bad packages are sent to a rejecting device(600), an unloading device(500), carting the selected packages to either a tray(T1) or a tube(T2), and more than a vision device(700), monitoring the ordering and transporting state of the package.
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