发明名称 SEMICONDUCTOR LIGHT RECEIVING ELEMENT AND MODULE FOR OPTICAL COMMUNICATION
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor light receiving element that is used for reception module for high-speed optical communication and is high in coupling efficiency, another semiconductor light receiving element that is used for transmission module for optical communication and can be mounted at a high density, and a transmission module for optical communication using the light receiving elements. SOLUTION: The semiconductor light receiving element used for reception module is composed of a light absorbing layer and a window layer. The light absorbing layer is formed on a substrate in a belt-like state, has light receiving surfaces on at least its one side face formed in the lengthwise direction, receives incident light which is almost parallel to the surface of the substrate through the light receiving surface, and converts the light into electric signals. The window layer has light-transmissivity against the incident light and leads the incident light to the light receiving surfaces. The semiconductor light receiving element used for transmission module is also composed of a light absorbing layer and a window layer. The light absorbing layer is formed on part of the substrate, has a side face which works as a light receiving surface, receives incident light which is almost parallel to the surface of the substrate through the light receiving surface, and converts the incident light into electric signals. The window layer has light-transmissivity against the incident light and leads the incident light to the light receiving surface. The module for optical communication is equipped with these semiconductor light receiving elements and an edge-emitting type light emitting element.
申请公布号 JP2002305319(A) 申请公布日期 2002.10.18
申请号 JP20010108851 申请日期 2001.04.06
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 ONO REIJI
分类号 H01L27/14;H01L31/10;(IPC1-7):H01L31/10 主分类号 H01L27/14
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