| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thick plate surface flaw inspecting method capable of providing a clear image of the surface flaw. SOLUTION: In the method, an image of a thick plate surface irradiated with a light source 1 for illumination is picked up, an image signal is processed by an image processing device 20, an image is displayed by an image output device, and the surface flaw of a thick plate 1 is inspected. The thick plate surface is irradiated at a projection angleαof 20-40 deg., and the image of the thick plate surface is picked up at a light receiving angleβofα±10 deg.. Since the projection angle is small and an image pickup device 15 is positioned in a substantially regular reflection direction of applying light from the light source 10 for illumination, a clear image of the surface flaw can be acquired by the shadow of the surface flaw.</p> |
