| 摘要 |
PROBLEM TO BE SOLVED: To conduct heat generated from the electronic component efficiently to the heat dispersion member, such as a heat sink, and at the same time to remove the electronic component and heat dissipation dispersion member, without damaging the structure of the heat dissipation sheet and electronic components, even after burn-in and heat cycle tests are executed to check the quality. SOLUTION: The heat dissipation structure body of electronic component is to be provided. In the heat dissipation structure body; a heat dissipation sheet, where a metal sheet and a heat-conducting member having viscosity are laminated between a heat generation electronic component and a heat dispersion member are to be contained; a metal sheet should be connected to the heat generation electronic component; and the heat-conducting member having viscosity should be connected to the heat dispersion member. |
